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恩智浦公司加速智能可穿戴产品开发

关键词:KW40Z多模无线电系统级芯片 Kinetis微控制器 数字压力传感器

时间:2016-02-25 14:51:18      来源:中电网

 
国际即时新闻(原文:英文)

NXP Accelerates Smart Wearable Product Development

Highlights
• NXP announces comprehensive hardware and software reference platforms for the wearable market supporting engineers from the maker community to OEMs with the foundation for their next innovation
• The Hexiwear platform, based on Kinetis MCUs, offers a complete, form-factor hardware and software solution that enables designers to move data from device sensors to the cloud
• Community-driven WaRP7 platform, based on i.MX 7Solo applications processor, built on ARM® Cortex®-A7 and Cortex-M4 cores, is introduced for rapid development of smart features into original product designs
NUREMBERG, Germany--(BUSINESS WIRE)--NXP Semiconductors N.V. (NASDAQ: NXPI) today announced new reference platforms to enable innovation and rapid development for smart wearables at Embedded World 2016.

“NXP is able to leverage its broad portfolio of products to offer comprehensive, form-factor reference designs for the wearable market, simplifying customer design and accelerating customer time to market”
From fitness and wellness to industrial and smart devices, these new reference platforms target a range of IoT applications with open-source hardware and software, form-factor flexibility, and expandable solutions for designers to adapt to changing market needs. By offering both MCU and MPU based reference platforms, NXP can scale to address the varied requirements and usage models enabling faster and more cost effective development and design.

“NXP is able to leverage its broad portfolio of products to offer comprehensive, form-factor reference designs for the wearable market, simplifying customer design and accelerating customer time to market,” said Geoff Lees, general manager and senior vice president of the microcontroller business line at NXP. “These new reference platforms target OEMs, as well as the larger maker community by offering versatility for designs that need to be smart, low-power, and expandable.”

Hexiwear Reference Platform enhanced by NXP
Based on Kinetis MCUs, the Hexiwear platform combines the style and usability found in high-end consumer devices, with the functionality and expandability of sophisticated engineering development platforms, making Hexiwear the ideal form factor for the wearable market, as well as other edge-node IoT solutions. Completely open-source and developed by MikroElektronika, in partnership with NXP, the Hexiwear hardware includes a breadth of NXP products: the low power, high performance Kinetis K6x microcontroller based on ARM Cortex-M4 core; the Kinetis KW40Z multimode radio SoC, supporting BLE in Hexiwear; three advanced NXP sensors: 6-axis accelerometer and magnetometer, 3-axis gyroscope, and an absolute digital pressure sensor; and an NXP single cell battery charger IC.

“NXP offers the most comprehensive portfolio of products for the wearable market and combined with the expansive enablement and community support, NXP was the ideal partner for the Hexiwear reference platform,” said Dr. Djordje Marinkovic, director of business development at of MikroElektronika. “The Hexiwear platform is also expandable with the option to add nearly 200 different, additional sensors through click boardsTM.”

The Hexiwear software includes open source application software, drivers and cloud connectivity, enabling designers to efficiently move data from the device’s sensors to the cloud. Hexiwear is supported with its own application for Android and iOS, so customers can connect the device to the cloud straight out of the box, without any additional software development. Hexiwear uses FreeRTOS, the Kinetis software development kit (SDK) and the Kinetis Design Studio IDE.

“Hexiwear is a complete IoT development system which, when integrated with our cloud platform, delivers feature-packed cloud solutions faster to the market,” said Alex Maniatopoulos, CEO of Yodiwo.

At a $49 USD suggested resale, samples of the Hexiwear platform are available now to early engagers, with full production scheduled to start in April 2016.
Kinetis Designs
The Hexiwear platform is also available for download from Kinetis Designs, the online portal for customers to access the latest open-source hardware and software reference designs based on Kinetis MCUs. Kinetis Designs provides access to information such as software, schematics and user documentation for quick use and customization. In addition to Hexiwear, Kinetis Designs also includes such wearable designs as the Bluetooth Low Energy heart rate monitoring platform. With new reference designs being added regularly, visit Kinetis Designs and Hexiwear at www.NXP.com/KinetisDesigns/Hexiwear.

WaRP7 Wearable Reference Platform enhanced by NXP
Based on i.MX 7Solo applications processors, WaRP7 is one of the most power-efficient MPU platforms for evaluation and rapid adoption into original product designs so wearable device designers can innovate and take a differentiated product to market faster. By utilizing the heterogeneous multicore architecture of the i.MX 7Solo device, WaRP7 allows customers to optimize power efficiency, lower the bill of materials, and it provides the ultimate in performance flexibility to address the varied usage models for the wearables market.

WaRP7 was developed in partnership with element14, a part of the Premier Farnell Group, and leverages the expansive NXP portfolio. The platform includes the new NXP i.MX 7Solo applications processor, PF3001 power management IC, BC3770 battery charger, three NXP sensors: 6-axis accelerometer and magnetometer, 3-axis gyroscope, and an absolute digital pressure sensor, and a near field communication (NFC) IC to enable short range communication and secure payments. The combination of the NFC IC and the extensive hardware security features of the i.MX 7Solo device allows customers to meet the security requirements of the diverse wearables market.
 “element14’s experience in small form factor design, manufacturing capability and experience with supporting the development community will enable wearable projects to utilize WaRP7 and potentially finally answer the question, where should I start to be successful in the wearables market,” said David Shen, Group Chief Technical Officer, Premier Farnell.

WaRP7 hardware and software will be open source to allow developers to take the platform as a starting point and innovate without licensing restrictions. Hardware engineers will benefit from schematics, Gerber files, and CAD files, while software engineers will be able to focus on their differentiation by leveraging NXP’s board support packages for Linux and Android optimized to run on the WaRP7 platform. A WaRP7 kit will include the main CPU board, the I/O daughter card and a battery. A touch screen LCD will be an optional choice. WaRP7 is scheduled to start shipping in full production in April 2016 at a $99 USD resale. More information can be found at www.element14.com/warp7.

Demonstrations at Embedded World 2016
NXP will demonstrate these new wearable reference platforms on February 23-25 at the Embedded World 2016 show, NXP IoT Truck and booth# 4A-220.









中文自动翻译,供参考

恩智浦公司加速智能可穿戴产品开发

亮点

恩智浦宣布可穿戴市场制造商小区配套工程师原始设备制造商为他们的下一次创新的基础上全面的硬件和软件参考平台

•在Hexiwear平台基于Kinetis微控制器提供了一个完整外形的硬件和软件解决方案,使设计人员从设备传感器的数据移动到云

社区驱动WaRP7平台基于i.MX应用7Solo处理器基于ARM®Cortex®-A7和Cortex-M4内核,引入了智能功能,迅速发展原来的产品设计

纽伦堡,德国 - (BUSINESS WIRE) - 恩智浦半导体不挥发物(NASDAQ:NXPI)今日宣布新的参考平台在嵌入式世界2016年,使创新和智能身打扮快速发展。

“恩智浦能够利用其广泛的产品组合为客户提供全面,外形参考设计可穿戴市场,简化客户设计并加速客户的产品上市时间”

从健身和健康产业和智能设备,这些新的参考平台针对一系列的物联网应用与开源硬件和软件,外形灵活性,并为设计师,以适应不断变化的市场需求,可扩展的解决方案。通过提供基于MCU和MPU参考平台,恩智浦可扩展,以满足不断变化的需求和使用模式实现更快和更具成本效益的开发和设计。

“恩智浦能够利用其广泛的产品组合为客户提供全面,外形参考设计可穿戴市场,简化客户设计并加速客户的产品上市时间,”总经理兼微控制器业务部高级副总裁杰夫·Lees表示恩智浦线。 “这些新的参考平台面向原始设备制造商,以及较大的制造商通过社区为需要聪明,低功耗,可扩展的设计,提供了通用性。”

Hexiwear参考平台加强恩智浦

基于Kinetis微控制器,该Hexiwear平台结合的风格和实用性的高端消费类设备中发现,与成熟的工程开发平台的功能和可扩展性,使得Hexiwear理想的外形尺寸为可穿戴市场,以及其他边缘节点物联网解决方案。完全开源的,由制造商mikroElektronika开发,在与恩智浦合作伙伴关系,Hexiwear硬件包括恩智浦产品的广度:低功耗,基于ARM Cortex-M4内核的高性能的Kinetis微控制器K6x;在Kinetis的KW40Z多模无线电系统级芯片,在支持Hexiwear BLE;三个高级NXP传感器:6轴加速度计和磁力计,3轴陀螺仪,和绝对数字压力传感器;和恩智浦的单节电池充电器IC。

“恩智浦提供的产品最全面的产品组合可穿戴的市场和广阔的启用和社会支持相结合,恩智浦是该Hexiwear参考平台理想的合作伙伴,”乔尔杰Marinkovic博士商mikroElektronika的业务发展总监说。 “该Hexiwear平台也是扩展通过点击boardsTM增加近200个不同的,额外的传感器的选项。”

该Hexiwear软件包括开源应用软件,驱动程序和云连接,使设计人员能够有效地从设备的传感器数据移动到云中。 Hexiwear支持自己的应用程序的Andr​​oid和iOS,因此用户可以将设备连接到云直开箱,没有任何额外的软件开发。 Hexiwear使用FreeRTOS操作系统,该软件的Kinetis开发工具包(SDK)和Kinetis的设计工作室IDE。

“Hexiwear是一个完整的物联网发展体系,当与我们的云平台相集成,提供功能丰富的云计算解决方案更快地推向市场,”Yodiwo的首席执行官Alex Maniatopoulos说。

在建议转售$ 49 USD in的Hexiwear平台的样品现已推出提前扣合,与全面生产预计于2016年4月启动。

Kinetis产品设计

该Hexiwear平台也可以从设计的Kinetis,在线门户网站,为客户访问基于Kinetis微控制器的最新开源硬件和软件参考设计下载。 Kinetis产品设计提供了获取信息,如软件,原理图和用户文档快速使用和定制。除了Hexiwear,Kinetis的设计还包括诸如可穿戴式设计的蓝牙低功耗心脏速率监测平台。与正在定期添加新的参考设计,请访问Kinetis产品设计和Hexiwear在www.NXP.com/KinetisDesigns/Hexiwear。

WaRP7可穿戴参考平台加强恩智浦

基于i.MX 7Solo应用处理器,WaRP7是评估和迅速普及到原有的产品设计使佩戴装置设计者可以创新,走差异化的产品更快地推向市场的最省电的微处理器平台之一。通过利用i.MX 7Solo设备的异构多核架构,WaRP7使客户能够优化电源效率,降低材料清单,并提供了终极性能的灵活性,以应对的各种使用模式的身打扮市场。

WaRP7是与e络盟的Premier Farnell集团集团的一部分共同开发,并充分利用广阔的恩智浦产品组合。该平台包括新NXP i.MX 7Solo应用处理器,PF3001电源管理IC,BC3770电池充电器,三NXP传感器:6轴的加速度计和磁力计,3轴陀螺仪,和一个绝对数字压力传感器,和近场通信(NFC)芯片,以使短程通信和安全支付。在NFC IC和i.MX 7Solo设备的广泛的硬件安全特征的组合允许客户满足多样化穿戴式市场的安全要求。

“e络盟在小巧的外形设计,制造能力和经验的经验与配套开发社区将使耐磨项目,以利用WaRP7并有可能最终回答这个问题,我应该从哪里开始是成功的穿戴式装置市场,”沈大伟,集团表示技术总监,Premier Farnell集团。

WaRP7硬件和软件将是开源的,允许开发者利用这个平台为起点,没有许可限制创新。硬件工程师将受益于原理图,Gerber文件和CAD文件,而软件工程师就能够通过利用优化的WaRP7平台上运行的Linux和Android恩智浦的板级支持包专注于自己的差异化。一个WaRP7套件将包括主CPU板,I / O子卡和电池。触摸屏液晶显示器将是一个可选的选择。 WaRP7定在$ 99 USD转售开始全面量产出货2016年4月。更多信息可在www.element14.com/warp7找到。

在嵌入式世界2016年演示

恩智浦将在嵌入式世界2016年展会上,恩智浦半导体物联网卡车和展位#4A-220表现出对2月23日至25日,这些新的可穿戴参考平台。

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